Heath Holcomb
979.204.6477
liquidcable@gmail.com
liquidcable.org
http://www.linkedin.com/in/heathholcomb

EXPERIENCE


Engineering Manager – Other World Computing (Austin, Tx) (Sep 2015 – Present)
Led development of Thunderbolt attached external storage devices.

  • Brought up and managed first engineering department in company
  • Thunderbolt 2 & 3 high speed circuit board and product design
  • Circuit design, schematic entry, and high speed PCB layout with Altium Designer
  • USB 3.0 (USB 3.1 Gen 1), PCIe, SATA, USB Type-C, Thunderbolt 2, Thunderbolt 3
  • Managed all aspects of development from concept to full volume production

Major Accomplishments:
– Got to market with first in house design of product (design, certification, pilot run, volume production).
– Designed Thunderbolt 3 M.2 PCIe SSD device for a Plugfest in under 5 weeks, with first prototype fully functional.

Hardware Design Engineer – FirstView Consultants (Austin, Tx) (Fed 2015 – Sep 2015)
Circuit design, schematic entry, and board layout for i.MX6 (ARM) based embedded single board computers.

  • Direct customer interface and design document generation
  • Circuit design, Schematic entry, and PCB Layout
  • BOM maintenance and generation
  • Board bring up and testing, board modification, fine pitch soldering and rework
  • Switching power supply design
  • Thermal analysis of embedded SBC
  • Circuit, Schematic, and Layout review of 3rd party designs

Electrical Engineer – Tolteq Group LLC (Cedar Park, Tx) (Feb 2010 – Feb 2015)
Developed and sustained Measurement while Drilling (MWD) tools.

  • Circuit design, schematic entry, and board layout using Altium Designer
  • Designed analog, digital, switching power supplies, microcontroller based, and high voltage circuits
  • Implemented and coordinated circuit design, layout, and IPC standards for entire company
  • Project management for development of Measurement While Drilling (MWD) tools
  • Developed circuit designs and construction techniques to mitigate damage from high shock and vibration
  • High temperature design (175°C)
  • BOM creation and maintenance
  • Develop procedures and maintain outside CM circuit board construction and cable harness
  • Test fixture design
  • Labview testing VI development
  • Production and repair support
  • Implemented company ECN and engineering control processes
  • Wrote internal ERP procedures

Head Engineer – Otis Instruments (Jan. 2007 – Dec. 2009)

  • Oversaw all product development
  • Schematic entry and PCB layout
  • Circuit design; analog, digital, and linear/switching power supply
  • Gas sensor interface; electrochemical, inferred, and catalytic bead / pellistor
  • PCB prototype assembly and test
  • Production documentation; assembly, testing, and quality assurance procedures
  • Class I Div 1 and ATEX Zone 1 explosion proof standards compliance design
  • Legacy product maintenance
  • Wireless product development; 900 MHz and 2.4 GHz ISM band
  • Oversaw all IT tasks
  • Oversaw new ERP implementation
  • Oversaw EN 13980 company implementation; based off of  ISO 9001

Project Engineer – Texas Digital Systems (Aug. 2001 – Jan. 2007)

  • Project management
  • Schematic entry and PCB layout
  • Circuit design; analog, digital, and linear/switching power supply
  • Production documentation; assembly, testing, and quality assurance procedures
  • Bill of materials creation
  • UL standards compliance design and RoHS compliance design
  • Legacy product maintenance
  • Microsoft XP Embedded design

EDUCATION


Texas A&M University (College Station, TX), May 2001
Bachelors of Science in Electronics Engineering Technology

TECHNICAL TOOLS AND SKILLS


Software

  • Altium Designer (schematic entry, PCB layout, revision control)
  • Orcad (lite experience years ago, schematic entry only)
  • AutoCad 2004 LT
  • MS Project, Confluence, JIRA
  • MS Office / LibreOffice
  • WordPress
  • Linux, Windows 98/NT/2000/XP/7/8, Windows XP Embedded, Mac OS X
  • LabVIEW
  • C (very lite experience years ago, open source project and embedded)
  • assembly (very lite experience years ago, 8051)

Hardware

  • soldering (surface mount, through hole)
  • DMM, oscilloscope, TDR (limited use)
  • logic analyzers, power supplies, DAQs
  • environmental chambers, vibration tables
  • accelerometers and ADCs

Technologies Familiar With

  • Circuit Board build process, DFM
  • ARM (Freescale i.MX6)
  • Microcontrollers; 8051, PIC18, PIC24, dsPIC
  • UART, 232, 485, I2C, SPI, Ethernet, SD, HDMI, USB, WiFi, Bluetooth
  • 4-20mA current loop
  • ADCs
  • Accelerometers
  • Electrochemical, inferred, and catalytic bead / pellistor gas sensors
  • Switch mode power supplies (buck, boost, tapped inductor, flyback, etc..); low and high voltage (1.6kV)
  • PMT (Photo Multiplier Tube) interface
  • USB, PCIe, SATA, M.2, Thunderbolt 2, Thunderbolt 3